8480.30.00.00/Wafer Slicing Saw Calibration Pattern/Japan

Wafer Slicing Saw Calibration Pattern from Japan

Diamond-patterned test piece for calibrating wafer slicing saws from semiconductor boules, per statistical note (a)(ii)(B). Falls under HTS 8480.30.00.00 as specialized molding pattern for semiconductor equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document kerf loss specs and boule slicing process linkage

• Declare as consumable calibration tool, not blade replacement