Wafer Slicing Saw Calibration Pattern from China
Diamond-patterned test piece for calibrating wafer slicing saws from semiconductor boules, per statistical note (a)(ii)(B). Falls under HTS 8480.30.00.00 as specialized molding pattern for semiconductor equipment.
Duty Rate — China → United States
40.3%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Document kerf loss specs and boule slicing process linkage
• Declare as consumable calibration tool, not blade replacement