Wafer Slicing Saw Calibration Pattern from Canada
Diamond-patterned test piece for calibrating wafer slicing saws from semiconductor boules, per statistical note (a)(ii)(B). Falls under HTS 8480.30.00.00 as specialized molding pattern for semiconductor equipment.
Duty Rate — Canada → United States
12.8%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document kerf loss specs and boule slicing process linkage
• Declare as consumable calibration tool, not blade replacement