Semiconductor Wafer Crystal Grinder Pattern from Japan
A precision molding pattern used to calibrate crystal grinders for semiconductor boule diameter control per statistical notes. HTS 8480.30.00.00 covers it as a pattern for semiconductor manufacturing equipment.
Duty Rate — Japan → United States
12.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Reference statistical note (a)(ii)(A) crystal grinders in documentation
• Include wafer specs (e.g
• 300mm silicon) and boule resistivity data