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8480.30.00.00/Semiconductor Wafer Crystal Grinder Pattern/Japan

Semiconductor Wafer Crystal Grinder Pattern from Japan

A precision molding pattern used to calibrate crystal grinders for semiconductor boule diameter control per statistical notes. HTS 8480.30.00.00 covers it as a pattern for semiconductor manufacturing equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Reference statistical note (a)(ii)(A) crystal grinders in documentation

• Include wafer specs (e.g

• 300mm silicon) and boule resistivity data

Semiconductor Wafer Crystal Grinder Pattern from Japan — Import Duty Rate | HTS 8480.30.00.00