Semiconductor Wafer Crystal Grinder Pattern from Japan
A precision molding pattern used to calibrate crystal grinders for semiconductor boule diameter control per statistical notes. HTS 8480.30.00.00 covers it as a pattern for semiconductor manufacturing equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Reference statistical note (a)(ii)(A) crystal grinders in documentation
• Include wafer specs (e.g
• 300mm silicon) and boule resistivity data