Semiconductor Wafer Crystal Grinder Pattern from China
A precision molding pattern used to calibrate crystal grinders for semiconductor boule diameter control per statistical notes. HTS 8480.30.00.00 covers it as a pattern for semiconductor manufacturing equipment.
Duty Rate — China → United States
40.3%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Reference statistical note (a)(ii)(A) crystal grinders in documentation
• Include wafer specs (e.g
• 300mm silicon) and boule resistivity data