High-Precision Mold Base for Semiconductor Wafer Trays from Japan
Ultra-precise mold base for injection molding plastic trays used in semiconductor wafer handling. Features sub-micron tolerances for cleanroom compatibility. Falls under HTS 8480.20.00.00 as plastics mold base.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide cleanroom certification and tolerance specs
• Declare as mold base, not semiconductor equipment to avoid 8486
• Ensure no classification under 3923 for plastic trays themselves