High-Precision Mold Base for Semiconductor Wafer Trays from Japan
Ultra-precise mold base for injection molding plastic trays used in semiconductor wafer handling. Features sub-micron tolerances for cleanroom compatibility. Falls under HTS 8480.20.00.00 as plastics mold base.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide cleanroom certification and tolerance specs
• Declare as mold base, not semiconductor equipment to avoid 8486
• Ensure no classification under 3923 for plastic trays themselves