High-Precision Mold Base for Semiconductor Wafer Trays from China
Ultra-precise mold base for injection molding plastic trays used in semiconductor wafer handling. Features sub-micron tolerances for cleanroom compatibility. Falls under HTS 8480.20.00.00 as plastics mold base.
Duty Rate — China → United States
40.9%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Provide cleanroom certification and tolerance specs
• Declare as mold base, not semiconductor equipment to avoid 8486
• Ensure no classification under 3923 for plastic trays themselves