High-Precision Mold Base for Semiconductor Wafer Trays from China
Ultra-precise mold base for injection molding plastic trays used in semiconductor wafer handling. Features sub-micron tolerances for cleanroom compatibility. Falls under HTS 8480.20.00.00 as plastics mold base.
Duty Rate — China → United States
38.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Provide cleanroom certification and tolerance specs
• Declare as mold base, not semiconductor equipment to avoid 8486
• Ensure no classification under 3923 for plastic trays themselves