Wafer Cleaning Centrifuge from Japan
High-speed centrifuge removing contaminants from semiconductor wafers post-polishing via centrifugal force. HTS 8479.90.95 for wafer preparation equipment. Handles 25-50 wafers per cycle.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document G-force specs (1000-3000G) and bowl design for wafer cassettes
• Provide chemical compatibility data for cleaning solvents used
• Avoid general centrifuge classification by proving semiconductor carrier compatibility