Silicon Ingot Grinder from Mexico
Precision grinder for shaping silicon ingots to exact diameter prior to wafer slicing in semiconductor production. Classified HTS 8479.90.95 as crystal grinder per statistical note. Handles 200mm-450mm diameter ingots.
Duty Rate — Mexico → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Specify ingot diameter range (150-450mm) and flat grinding positions (primary/secondary flats)
• Include vibration isolation and coolant filtration system descriptions
• Distinguish from metallurgical grinders by semiconductor material handling features