Double-Sided Wafer Polisher from Germany
Machine simultaneously polishing both sides of semiconductor wafers to mirror finish using chemical-mechanical planarization (CMP). HTS 8479.90.95 for wafer preparation polishers in statistical note. Achieves nanometer-level surface flatness.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Provide CMP slurry flow rates and pad pressure specs in import declaration
• Demonstrate carrier head design for simultaneous polishing both wafer surfaces
• Avoid classification as general CMP under 8460 by proving semiconductor-specific tolerances