Crystal Boule Grinder from Japan
Machine that grinds semiconductor crystal boules to precise diameter and adds flats indicating conductivity type and resistivity. Meets HTS 8479.90.95 as wafer preparation equipment per statistical note. Essential step before wafer slicing in semiconductor production.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Submit engineering drawings showing diamond grinding wheels and flat orientation mechanisms
• Documentation should reference specific tolerances (e.g
• ±0.1mm diameter control)
• Avoid pitfall of Chapter 84 part classification; prove complete functional machine status