Silicon Ingot Grinder from Japan

Grinding machine for semiconductor silicon ingots to precise diameters with orientation flats for wafer slicing. Falls in HTS 8479.89.95 as crystal grinders per statistical notes on wafer manufacturing equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify grind flat standards (SEMI specs); avoid reclassification by documenting resistivity marking

• High-value—use binding rulings