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8479.89.95/Silicon Ingot Grinder/China

Silicon Ingot Grinder from China

Grinding machine for semiconductor silicon ingots to precise diameters with orientation flats for wafer slicing. Falls in HTS 8479.89.95 as crystal grinders per statistical notes on wafer manufacturing equipment.

Duty Rate — China → United States

40%

Rate breakdown

9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
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Import Tips

• Specify grind flat standards (SEMI specs); avoid reclassification by documenting resistivity marking

• High-value—use binding rulings

Silicon Ingot Grinder from China — Import Duty Rate | HTS 8479.89.95