Semiconductor Wafer Slicing Saw from Mexico
High-precision diamond saw for slicing thin wafers from monocrystalline semiconductor boules like silicon. Falls under HTS 8479.89.95 as explicit wafer preparation equipment in statistical notes for semiconductor manufacturing.
Duty Rate — Mexico → United States
12.5%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document blade specs and wafer thickness capabilities; avoid pitfalls by classifying complete systems vs parts
• Requires FCC compliance for controls