8479.89.95/Semiconductor Wafer Slicing Saw/Japan

Semiconductor Wafer Slicing Saw from Japan

High-precision diamond saw for slicing thin wafers from monocrystalline semiconductor boules like silicon. Falls under HTS 8479.89.95 as explicit wafer preparation equipment in statistical notes for semiconductor manufacturing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document blade specs and wafer thickness capabilities; avoid pitfalls by classifying complete systems vs parts

• Requires FCC compliance for controls