Semiconductor Wafer Slicing Saw from Germany
High-precision diamond saw for slicing thin wafers from monocrystalline semiconductor boules like silicon. Falls under HTS 8479.89.95 as explicit wafer preparation equipment in statistical notes for semiconductor manufacturing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document blade specs and wafer thickness capabilities; avoid pitfalls by classifying complete systems vs parts
• Requires FCC compliance for controls