Semiconductor Wafer Slicing Saw from Canada
High-precision diamond saw for slicing thin wafers from monocrystalline semiconductor boules like silicon. Falls under HTS 8479.89.95 as explicit wafer preparation equipment in statistical notes for semiconductor manufacturing.
Duty Rate — Canada → United States
12.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document blade specs and wafer thickness capabilities; avoid pitfalls by classifying complete systems vs parts
• Requires FCC compliance for controls