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8479.89.95/Semiconductor Wafer Polisher/Japan

Semiconductor Wafer Polisher from Japan

Chemical-mechanical polisher (CMP) preparing wafer surfaces to atomic flatness for device fabrication. HTS 8479.89.95 covers wafer polishers as essential semiconductor preparation equipment per statistical notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Include slurry delivery system valuations; pitfall: classifying as parts vs complete machine

• EPA chemical handling certs needed

Semiconductor Wafer Polisher from Japan — Import Duty Rate | HTS 8479.89.95