8479.89.95/Gallium Arsenide Wafer Slicer/Japan

Gallium Arsenide Wafer Slicer from Japan

Specialized saw for slicing fragile GaAs wafers from compound semiconductor boules. HTS 8479.89.95 includes such wafer slicing equipment for materials like gallium arsenide per official notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Hazardous material handling docs for GaAs; common issue: vibration specs undocumented

• ITAR checks for defense apps