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8479.89.95/Double-Sided Wafer Grinder/Mexico

Double-Sided Wafer Grinder from Mexico

Simultaneous double-sided grinding machine achieving uniform wafer thickness for semiconductor processing. Classified under HTS 8479.89.95 wafer grinders per statistical definitions.

Duty Rate — Mexico → United States

12.5%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Thickness variation data (<0.5um) required; pitfall: software export controls overlooked