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8479.89.95/Double-Sided Wafer Grinder/Japan

Double-Sided Wafer Grinder from Japan

Simultaneous double-sided grinding machine achieving uniform wafer thickness for semiconductor processing. Classified under HTS 8479.89.95 wafer grinders per statistical definitions.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
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Import Tips

• Thickness variation data (<0.5um) required; pitfall: software export controls overlooked

Double-Sided Wafer Grinder from Japan — Import Duty Rate | HTS 8479.89.95