8479.89.95/Double-Sided Wafer Grinder/Japan

Double-Sided Wafer Grinder from Japan

Simultaneous double-sided grinding machine achieving uniform wafer thickness for semiconductor processing. Classified under HTS 8479.89.95 wafer grinders per statistical definitions.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Thickness variation data (<0.5um) required; pitfall: software export controls overlooked