8479.89.95/Double-Sided Wafer Grinder/Japan

Double-Sided Wafer Grinder from Japan

Simultaneous double-sided grinding machine achieving uniform wafer thickness for semiconductor processing. Classified under HTS 8479.89.95 wafer grinders per statistical definitions.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Thickness variation data (<0.5um) required; pitfall: software export controls overlooked