8479.89.95/Double-Sided Wafer Grinder/Germany

Double-Sided Wafer Grinder from Germany

Simultaneous double-sided grinding machine achieving uniform wafer thickness for semiconductor processing. Classified under HTS 8479.89.95 wafer grinders per statistical definitions.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%

Calculate with your customs value Verify classification with AI

Import Tips

• Thickness variation data (<0.5um) required; pitfall: software export controls overlooked