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8479.89.95/Double-Sided Wafer Grinder/China

Double-Sided Wafer Grinder from China

Simultaneous double-sided grinding machine achieving uniform wafer thickness for semiconductor processing. Classified under HTS 8479.89.95 wafer grinders per statistical definitions.

Duty Rate — China → United States

40%

Rate breakdown

9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
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Import Tips

• Thickness variation data (<0.5um) required; pitfall: software export controls overlooked