Crystal boule Diameter Grinder from Japan
Precision grinder maintaining semiconductor boule diameter uniformity for consistent wafer yield. HTS 8479.89.95 as crystal grinders in wafer prep equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• SEMI standard compliance proof; valuation includes diamond wheels