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Crystal boule Diameter Grinder from Japan

Precision grinder maintaining semiconductor boule diameter uniformity for consistent wafer yield. HTS 8479.89.95 as crystal grinders in wafer prep equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Import Tips

SEMI standard compliance proof; valuation includes diamond wheels