CMP Wafer Polishing Station from Japan
Complete chemical mechanical polishing station for wafer planarization. Full HTS 8479.89.95 semiconductor polisher coverage.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Chemical compatibility docs; slurry system separate valuation