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8479.89.95/CMP Wafer Polishing Station/Japan

CMP Wafer Polishing Station from Japan

Complete chemical mechanical polishing station for wafer planarization. Full HTS 8479.89.95 semiconductor polisher coverage.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Chemical compatibility docs; slurry system separate valuation