8479.89.95/Automated Wafer Edge Grinder/Japan

Automated Wafer Edge Grinder from Japan

Robotic edge grinding machine preventing wafer chipping during handling in fabs. HTS 8479.89.95 wafer grinder category.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Robot safety certifications; throughput specs in docs

Automated Wafer Edge Grinder from Japan — Import Duty Rate | HTS 8479.89.95