Automated Wafer Edge Grinder from Japan
Robotic edge grinding machine preventing wafer chipping during handling in fabs. HTS 8479.89.95 wafer grinder category.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Robot safety certifications; throughput specs in docs