8479.89.65.00/Wafer Slicing Diamond Saw/Mexico

Wafer Slicing Diamond Saw from Mexico

High-precision inner-diameter saw with self-contained motor and diamond blade for slicing ultra-thin semiconductor wafers from monocrystalline boules while maintaining crystal orientation. Uses coolant systems and automated feed for minimal kerf loss. Classified in HTS 8479.89.65.00 as essential wafer manufacturing apparatus.

Duty Rate — Mexico → United States

12.8%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Calculate with your customs valueVerify classification with AI

Import Tips

• Specify inner-diameter saw design and wafer thickness capability (<500μm) for proper classification

• Import blades separately under 8202.39 to optimize duties versus complete machine

• Provide vibration isolation specs proving semiconductor cleanroom compatibility

Wafer Slicing Diamond Saw from Mexico — Import Duty Rate | HTS 8479.89.65.00