Wafer Slicing Diamond Saw from Canada
High-precision inner-diameter saw with self-contained motor and diamond blade for slicing ultra-thin semiconductor wafers from monocrystalline boules while maintaining crystal orientation. Uses coolant systems and automated feed for minimal kerf loss. Classified in HTS 8479.89.65.00 as essential wafer manufacturing apparatus.
Duty Rate — Canada → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Specify inner-diameter saw design and wafer thickness capability (<500μm) for proper classification
• Import blades separately under 8202.39 to optimize duties versus complete machine
• Provide vibration isolation specs proving semiconductor cleanroom compatibility