Wafer Slicing Diamond Saw from Canada
High-precision inner-diameter saw with self-contained motor and diamond blade for slicing ultra-thin semiconductor wafers from monocrystalline boules while maintaining crystal orientation. Uses coolant systems and automated feed for minimal kerf loss. Classified in HTS 8479.89.65.00 as essential wafer manufacturing apparatus.
Duty Rate — Canada → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Specify inner-diameter saw design and wafer thickness capability (<500μm) for proper classification
• Import blades separately under 8202.39 to optimize duties versus complete machine
• Provide vibration isolation specs proving semiconductor cleanroom compatibility