Wafer Edge Profiling Machine from Japan
Electromechanical device with self-contained motor that grinds beveled edge profiles on semiconductor wafers to prevent chipping and enable handling. Creates specific edge geometries for robotic transfer. Classified under HTS 8479.89.65.00 wafer preparation.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.1015%Section 232: ag equipment + residential HVAC, MFN<15% — 15% ceiling (Annex III addition)
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Document edge geometry specs (e.g
• 'shark's tooth' profile) unique to semiconductor wafers
• Ensure robotic interface compatibility documented for fab integration
• Classify profilometer components separately if removable