8479.89.65.00/Wafer Edge Profiling Machine/Germany

Wafer Edge Profiling Machine from Germany

Electromechanical device with self-contained motor that grinds beveled edge profiles on semiconductor wafers to prevent chipping and enable handling. Creates specific edge geometries for robotic transfer. Classified under HTS 8479.89.65.00 wafer preparation.

Duty Rate — Germany → United States

12.8%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Document edge geometry specs (e.g

• 'shark's tooth' profile) unique to semiconductor wafers

• Ensure robotic interface compatibility documented for fab integration

• Classify profilometer components separately if removable