Wafer Edge Profiling Machine from Germany
Electromechanical device with self-contained motor that grinds beveled edge profiles on semiconductor wafers to prevent chipping and enable handling. Creates specific edge geometries for robotic transfer. Classified under HTS 8479.89.65.00 wafer preparation.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Document edge geometry specs (e.g
• 'shark's tooth' profile) unique to semiconductor wafers
• Ensure robotic interface compatibility documented for fab integration
• Classify profilometer components separately if removable