Wafer Edge Profiling Machine from China
Electromechanical device with self-contained motor that grinds beveled edge profiles on semiconductor wafers to prevent chipping and enable handling. Creates specific edge geometries for robotic transfer. Classified under HTS 8479.89.65.00 wafer preparation.
Duty Rate — China → United States
20.3%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Import Tips
• Document edge geometry specs (e.g
• 'shark's tooth' profile) unique to semiconductor wafers
• Ensure robotic interface compatibility documented for fab integration
• Classify profilometer components separately if removable