Double-Sided Wafer Polisher from Mexico
Automated polishing machine with self-contained electric motors that simultaneously polishes both sides of semiconductor wafers using polyurethane pads and colloidal silica slurry to achieve mirror finish and extreme flatness. Prepares wafers for device fabrication. Falls under HTS 8479.89.65.00 per statistical note.
Duty Rate — Mexico → United States
12.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document polishing removal rates and surface roughness specs (Ångstrom level) for classification
• Handle chemical slurry delivery systems carefully for proper chemical handling declarations
• Verify cleanroom compatibility (HEPA filtration, vibration isolation) in technical docs