Double-Sided Wafer Polisher from China
Automated polishing machine with self-contained electric motors that simultaneously polishes both sides of semiconductor wafers using polyurethane pads and colloidal silica slurry to achieve mirror finish and extreme flatness. Prepares wafers for device fabrication. Falls under HTS 8479.89.65.00 per statistical note.
Duty Rate — China → United States
22.5%
Rate breakdown
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
9903.82.1015%Section 232: ag equipment + residential HVAC, MFN<15% — 15% ceiling (Annex III addition)
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Document polishing removal rates and surface roughness specs (Ångstrom level) for classification
• Handle chemical slurry delivery systems carefully for proper chemical handling declarations
• Verify cleanroom compatibility (HEPA filtration, vibration isolation) in technical docs