Double-Sided Wafer Polisher from China
Automated polishing machine with self-contained electric motors that simultaneously polishes both sides of semiconductor wafers using polyurethane pads and colloidal silica slurry to achieve mirror finish and extreme flatness. Prepares wafers for device fabrication. Falls under HTS 8479.89.65.00 per statistical note.
Duty Rate — China → United States
20.3%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Import Tips
• Document polishing removal rates and surface roughness specs (Ångstrom level) for classification
• Handle chemical slurry delivery systems carefully for proper chemical handling declarations
• Verify cleanroom compatibility (HEPA filtration, vibration isolation) in technical docs