Crystal Diameter Grinder from China
Motorized grinding apparatus that precisely reduces semiconductor boule diameter to standard wafer sizes (150mm, 200mm, 300mm) while maintaining cylindrical geometry. Includes automated measurement feedback. HTS 8479.89.65.00 for boule preparation equipment.
Duty Rate — China → United States
20.3%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Import Tips
• Specify supported boule diameters confirming semiconductor standards
• Classify diamond wheels separately under 6804.21 for potential duty savings
• Include roundness/taper specifications proving precision requirements