Kipac Cold Isostatic Press Model 500 from Japan
Kipac Model 500 is a high-pressure cold isostatic press designed for densifying semiconductor-grade silicon carbide powders into near-net-shape components. Operating at pressures up to 500 MPa in a flexible mold submerged in fluid, it eliminates die-wall friction for uniform density crucial in wafer substrate production. Falls under HTS 8479.83.00.00 as a dedicated cold isostatic pressing machine.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document maximum operating pressure and fluid medium type for proper 8479.83 classification
• Prepare safety data sheets for pressurizing fluids; US customs often requires hazmat review
• Avoid misclassification as molding machinery by emphasizing isostatic pressure uniformity