Kipac Cold Isostatic Press Model 500 from China

Kipac Model 500 is a high-pressure cold isostatic press designed for densifying semiconductor-grade silicon carbide powders into near-net-shape components. Operating at pressures up to 500 MPa in a flexible mold submerged in fluid, it eliminates die-wall friction for uniform density crucial in wafer substrate production. Falls under HTS 8479.83.00.00 as a dedicated cold isostatic pressing machine.

Duty Rate — China → United States

37.5%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)

Import Tips

Document maximum operating pressure and fluid medium type for proper 8479.83 classification

Prepare safety data sheets for pressurizing fluids; US customs often requires hazmat review

Avoid misclassification as molding machinery by emphasizing isostatic pressure uniformity