EPSI Tri-Axial Cold Isostatic Press from Japan
EPSI's tri-axial cold isostatic press uses three-dimensional pressure application for producing large-diameter semiconductor ceramic tubes and rods from powders. It achieves 200-600 MPa hydrostatic compaction at room temperature, essential for consistent microstructures in GaAs device substrates. HTS 8479.83.00.00 covers this specialized isostatic compaction equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide engineering drawings showing tri-axial pressure chamber design for classification proof
• Certify for cleanroom compatibility if destined for semiconductor fabs; affects documentation