EPSI Tri-Axial Cold Isostatic Press from Japan
EPSI's tri-axial cold isostatic press uses three-dimensional pressure application for producing large-diameter semiconductor ceramic tubes and rods from powders. It achieves 200-600 MPa hydrostatic compaction at room temperature, essential for consistent microstructures in GaAs device substrates. HTS 8479.83.00.00 covers this specialized isostatic compaction equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide engineering drawings showing tri-axial pressure chamber design for classification proof
• Certify for cleanroom compatibility if destined for semiconductor fabs; affects documentation