EPSI Tri-Axial Cold Isostatic Press from China
EPSI's tri-axial cold isostatic press uses three-dimensional pressure application for producing large-diameter semiconductor ceramic tubes and rods from powders. It achieves 200-600 MPa hydrostatic compaction at room temperature, essential for consistent microstructures in GaAs device substrates. HTS 8479.83.00.00 covers this specialized isostatic compaction equipment.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Provide engineering drawings showing tri-axial pressure chamber design for classification proof
• Certify for cleanroom compatibility if destined for semiconductor fabs; affects documentation