Wafer Grinding Coolant Agitator from Mexico
Continuous stirring machine for coolant reservoirs in wafer grinders/lappers, preventing abrasive settling during backgrinding to achieve <1 micron flatness. HTS 8479.82.0040 for semiconductor wafer preparation equipment mixing per statistical note (a)(ii)(C). Maintains suspension for TTV control.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify coolant flow rates matching grinder specifications (5-20 GPM)
• Provide particle settling prevention test results for sub-micron abrasives