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8479.82.00.40/Wafer Grinding Coolant Agitator/Japan

Wafer Grinding Coolant Agitator from Japan

Continuous stirring machine for coolant reservoirs in wafer grinders/lappers, preventing abrasive settling during backgrinding to achieve <1 micron flatness. HTS 8479.82.0040 for semiconductor wafer preparation equipment mixing per statistical note (a)(ii)(C). Maintains suspension for TTV control.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify coolant flow rates matching grinder specifications (5-20 GPM)

• Provide particle settling prevention test results for sub-micron abrasives

Wafer Grinding Coolant Agitator from Japan — Import Duty Rate | HTS 8479.82.00.40