Wafer Grinding Coolant Agitator from Japan
Continuous stirring machine for coolant reservoirs in wafer grinders/lappers, preventing abrasive settling during backgrinding to achieve <1 micron flatness. HTS 8479.82.0040 for semiconductor wafer preparation equipment mixing per statistical note (a)(ii)(C). Maintains suspension for TTV control.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify coolant flow rates matching grinder specifications (5-20 GPM)
• Provide particle settling prevention test results for sub-micron abrasives