Wafer Grinding Coolant Agitator from Germany
Continuous stirring machine for coolant reservoirs in wafer grinders/lappers, preventing abrasive settling during backgrinding to achieve <1 micron flatness. HTS 8479.82.0040 for semiconductor wafer preparation equipment mixing per statistical note (a)(ii)(C). Maintains suspension for TTV control.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify coolant flow rates matching grinder specifications (5-20 GPM)
• Provide particle settling prevention test results for sub-micron abrasives