Semiconductor Wafer Slurry Mixer from Japan
High-precision mixing machine for preparing diamond or silica slurry used in wafer slicing saws, ensuring uniform abrasive particle dispersion critical for thin kerf cuts in silicon wafers. Falls under HTS 8479.82.0040 as semiconductor-specific mixing equipment per statistical notes for wafer preparation. Maintains slurry viscosity for defect-free wafer slicing from crystal boules.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document particle size distribution specs (e.g
• <1 micron) proving semiconductor application
• Include abrasive concentration control validation to meet wafer slicing tolerance requirements