Single Wafer Polishing Tool from Japan
Advanced polisher that processes individual semiconductor wafers using chemical-mechanical planarization (CMP) to achieve mirror-like surface finish. Prepares wafers for photolithography and device formation. Classified HTS 8479.79.00.00 for specialized surface finishing machinery.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Detail CMP pad and slurry chemistry compatibility; ensure EPA compliance for waste
• Avoid classification as general CMP under 8460