Single Wafer Polishing Tool from China
Advanced polisher that processes individual semiconductor wafers using chemical-mechanical planarization (CMP) to achieve mirror-like surface finish. Prepares wafers for photolithography and device formation. Classified HTS 8479.79.00.00 for specialized surface finishing machinery.
Duty Rate — China → United States
17.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Import Tips
• Detail CMP pad and slurry chemistry compatibility; ensure EPA compliance for waste
• Avoid classification as general CMP under 8460