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8479.79.00.00/Single Wafer Polishing Tool/Canada

Single Wafer Polishing Tool from Canada

Advanced polisher that processes individual semiconductor wafers using chemical-mechanical planarization (CMP) to achieve mirror-like surface finish. Prepares wafers for photolithography and device formation. Classified HTS 8479.79.00.00 for specialized surface finishing machinery.

Duty Rate — Canada → United States

10%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
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Import Tips

• Detail CMP pad and slurry chemistry compatibility; ensure EPA compliance for waste

• Avoid classification as general CMP under 8460

Single Wafer Polishing Tool from Canada — Import Duty Rate | HTS 8479.79.00.00