Semiconductor Wafer Slicing Saw from Mexico
High-precision inner-diameter saw designed to slice ultra-thin wafers from monocrystalline semiconductor boules with minimal material loss. Ensures flatness and minimal subsurface damage for subsequent processing. HTS 8479.79.00.00 applies to this specialized slicing apparatus.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide kerf loss data and wire specifications for classification; comply with vibration standards for cleanrooms
• Common error: classifying as diamond saws under 8464