Semiconductor Wafer Slicing Saw from Japan
High-precision inner-diameter saw designed to slice ultra-thin wafers from monocrystalline semiconductor boules with minimal material loss. Ensures flatness and minimal subsurface damage for subsequent processing. HTS 8479.79.00.00 applies to this specialized slicing apparatus.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide kerf loss data and wire specifications for classification; comply with vibration standards for cleanrooms
• Common error: classifying as diamond saws under 8464