Semiconductor Wafer Slicing Saw from Germany
High-precision inner-diameter saw designed to slice ultra-thin wafers from monocrystalline semiconductor boules with minimal material loss. Ensures flatness and minimal subsurface damage for subsequent processing. HTS 8479.79.00.00 applies to this specialized slicing apparatus.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Provide kerf loss data and wire specifications for classification; comply with vibration standards for cleanrooms
• Common error: classifying as diamond saws under 8464