Semiconductor Wafer Slicing Saw from Canada
High-precision inner-diameter saw designed to slice ultra-thin wafers from monocrystalline semiconductor boules with minimal material loss. Ensures flatness and minimal subsurface damage for subsequent processing. HTS 8479.79.00.00 applies to this specialized slicing apparatus.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Provide kerf loss data and wire specifications for classification; comply with vibration standards for cleanrooms
• Common error: classifying as diamond saws under 8464