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8479.79.00.00/Multi-Wire Wafer Slicer/Mexico

Multi-Wire Wafer Slicer from Mexico

Advanced diamond wire saw using multiple parallel wires to simultaneously slice hundreds of thin wafers from a single boule, maximizing yield. Fixed abrasive technology reduces slurry use. Classified under HTS 8479.79.00.00 for high-throughput wafer production.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Specify wire diameter (50-100μm) and slice thickness capability; tensioning system details required

• Avoid generic saw classification

Multi-Wire Wafer Slicer from Mexico — Import Duty Rate | HTS 8479.79.00.00